TPS709

SBVS186G – MARCH 2012 – REVISED NOVEMBER 2015

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Table of Contents

1

Features .................................................................. 1

8

Application and Implementation ........................ 15

8.1

Application Information............................................ 15

2

Applications ........................................................... 1

8.2

Typical Application ................................................. 15

3

Description ............................................................. 1

9

Power Supply Recommendations ...................... 16

4

Revision History..................................................... 2

9.1

Power Dissipation ................................................... 16

5

Pin Configuration and Functions ......................... 4

10

Layout................................................................... 17

6

Specifications......................................................... 5

10.1

Layout Guidelines ................................................. 17

6.1

Absolute Maximum Ratings ...................................... 5

10.2

Layout Example .................................................... 17

6.2

ESD Ratings.............................................................. 5

11

Device and Documentation Support ................. 18

6.3

Recommended Operating Conditions ....................... 5

11.1

Device Support...................................................... 18

6.4

Thermal Information .................................................. 5

11.2

Documentation Support ........................................ 18

6.5

Electrical Characteristics........................................... 6

11.3

Community Resources.......................................... 18

6.6

Typical Characteristics .............................................. 7

11.4

Trademarks ........................................................... 19

7

Detailed Description ............................................ 13

11.5

Electrostatic Discharge Caution ............................ 19

7.1

Overview ................................................................. 13

11.6

Glossary ................................................................ 19

7.2

Functional Block Diagram ....................................... 13

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 13

Information ........................................................... 19

7.4

Device Functional Modes........................................ 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (December 2014) to Revision G

Page

•

Added DBV package for TPS709A to Pin Configurations and Functions section.................................................................. 4

•

Added DBV package for TPS709B to Pin Configurations and Functions section.................................................................. 4

•

Added TPS709A and TPS709B to Pin Functions table ......................................................................................................... 4

•

Moved operating junction temperature from Electrical Characteristics to Recommended Operating Conditions ................. 5

Changes from Revision E (November 2013) to Revision F

Page

•

Changed title format to meet latest data sheet standards...................................................................................................... 1

•

Added ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section .................................................................................................. 1

•

Deleted SOT-223-4 package from document ........................................................................................................................ 1

•

Deleted Low Dropout Features bullet .................................................................................................................................... 1

•

Changed Packages Feature bullet: deleted SOT-223-4 and footnote .................................................................................. 1

•

Deleted SOT-223-4 from last paragraph of Description section ........................................................................................... 1

•

Deleted pinout graphics from page 1 .................................................................................................................................... 1

•

Deleted DCY package and footnote from Pin Configurations section ................................................................................... 4

•

Changed Pin Functions table: changed title and deleted DCY package................................................................................ 4

•

Changed EN pin description in Pin Functions table .............................................................................................................. 4

•

Deleted the word 'range' from the last 2 rows of the Absolute Maximum Ratings table ........................................................ 5

•

Deleted DCY column from Thermal Information table ........................................................................................................... 5

•

Added description text to the enabled mode discussion in the Device Functional Modes section ..................................... 14

2

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