LSM6DSRTR datasheet(3/168 Pages) STMICROELECTRONICS

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Overview

The LSM6DSR is a system-in-package featuring a high-performance 3-axis digital accelerometer and 3-axis

digital gyroscope.

The LSM6DSR delivers best-in-class motion sensing that can detect orientation and gestures in order to empower

application developers and consumers with features and capabilities that are more sophisticated than simply

orienting their devices to portrait and landscape mode.

This device is suitable for augmented reality and virtual reality applications as well as Optical Image Stabilization

and motion-based gaming controllers as a result of its high stability over temperature and time, combined with

superior sensing precision.

The LSM6DSR fully supports OIS applications using both the gyroscope and accelerometer sensor. The device

can output OIS data through a dedicated auxiliary SPI and includes a dedicated configurable signal processing

path for OIS. For both the gyroscope and accelerometer, the UI signal processing path is completely independent

from that of the OIS and is readable through FIFO. Moreover, self -test and full scale are available for both the UI

and OIS chains.

The event-detection interrupts enable efficient and reliable motion tracking and contextual awareness,

implementing hardware recognition of free-fall events, 6D orientation, click and double-click sensing, activity or

inactivity, and wakeup events.

The LSM6DSR supports main OS requirements, offering real, virtual and batch mode sensors. In addition, the

LSM6DSR can efficiently run the sensor-related features specified in Android. In particular, the LSM6DSR has

been designed to implement hardware features such as significant motion, tilt, pedometer functions, timestamping

and to support the data acquisition of an external magnetometer.

The LSM6DSR offers hardware flexibility to connect the pins with different mode connections to external sensors

to expand functionalities such as adding a sensor hub.

Up to 9 kbytes of FIFO with compression and dynamic allocation of significant data (i.e. external sensors,

timestamp, etc.) allows overall power saving of the system.

Like the entire portfolio of MEMS sensor modules, the LSM6DSR leverages the robust and mature in-house

manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The

various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces

are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better

match the characteristics of the sensing element.

The LSM6DSR is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x 0.83 mm to address

ultra-compact solutions.

LSM6DSR

Overview

DS11976 - Rev 2

page 3/168

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