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L7983 数据表(PDF) 5 Page - STMicroelectronics |
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L7983 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 43 page ![]() 3 Absolute maximum ratings Stressing the device above the ratings listed in Table 2 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Table 2. Absolute maximum ratings Symbol Description Min. Max. Unit VIN See Table 1 -0.3 63 V VCC -0.3 VIN + 0.3 or max. 3.6 V EN/UVLO -0.3 VIN + 0.3 V RST V LX -0.3 VIN + 0.3 V VBIAS -0.3 VIN + 0.3 or max. 14 V VOUT/FB -0.3 5.5 V LNM/LCM V FSW -0.3 VCC + 0.3 V IHS, ILS High-side / low-side RMS switch current 0.3 A TJ Operating temperature range -40 150 °C TSTG Storage temperature range -65 150 TLEAD Lead temperature (soldering 10 sec.) 260 3.1 Thermal characteristics Table 3. Thermal data Symbol Parameter Value Unit RthJA Thermal resistance junction to ambient (device soldered on a standard demonstration board) 50 °C/W 3.2 ESD protection Table 4. ESD performance Symbol Test conditions Value Unit ESD HBM 2 kV CDM 500 V L7983 Absolute maximum ratings DS13354 - Rev 1 page 5/43 |
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