Data Sheet

ADRF5300

Rev. 0 | Page 9 of 11

APPLICATIONS INFORMATION

LAYOUT CONSIDERATIONS

The design of the ADRF5300-EVALZ serves as a layout

recommendation for the ADRF5300 application.

The ADRF5300-EVALZ is a 4-layer evaluation board. The

outer copper (Cu) layers are 0.5 oz (0.7 mil) plated to 1.5 oz

(2.2 mil) separated by dielectric materials. Figure 15 shows the

ADRF5300-EVALZ stack up.

For additional information on application circuit design, see

the ADRF5300-EVALZ user guide.

0.5oz Cu (0.7mil)

RO4003

0.5oz Cu (0.7mil)

1.5oz Cu (2.2mil)

1.5oz Cu (2.2mil)

W = 14mil

G = 7mil

T = 2.2mil

H = 8mil

1.5oz Cu (2.2mil)

1.5oz Cu (2.2mil)

Figure 15. ADRF5300-EVALZ Stack Up

All RF and dc traces are routed on the top copper layer,

whereas the inner and bottom layers are grounded planes that

provide a solid ground for the RF transmission lines. The top

dielectric material is 8 mil Rogers RO4003, offering optimal high

frequency performance. The middle and bottom dielectric

materials provide mechanical strength. The total board

thickness is 62 mil, which allows 2.4 mm RF launchers to

connect at the board edges.

RF AND DIGITAL CONTROLS

The RF transmission lines are designed using a coplanar

waveguide (CPWG) model, with a trace width of 14 mil and a

ground clearance of 7 mil to have a characteristic impedance of

50 Ω. For optimal RF and thermal grounding, as many plated

through vias as possible are arranged around transmission lines

and under the exposed pad of the package.

The RF ports (RFC, RF1, and RF2) connect through 50 Ω

transmission lines to the 2.4 mm RF launchers. On the VDD pin,

a 100 pF bypass capacitor filters high frequency noise.

Figure 16 shows the simplified application circuit for the

ADRF5300-EVALZ.

RFC

RF2

RF1

GND

GND

RFC

GND

GND

GND

GND

GND

CTRL

VDD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

ADRF5300

100pF

Figure 16. ADRF5300-EVALZ Simplified Application Circuit

PROBE MATRIX BOARD

The probe matrix board is a 4-layer evaluation board. This

board also uses an 8 mil Rogers RO4003 dielectric. The outer

copper (Cu) layers are 0.5 oz (0.7 mil) plated to 1.5 oz (2.2 mil).

The RF transmission lines were designed using a CPWG model

with a width of 14 mil and a ground spacing of 7 mil to have a

characteristic impedance of 50 Ω.

0.5oz Cu (0.7mil)

RO4003

0.5oz Cu (0.7mil)

1.5oz Cu (2.2mil)

1.5oz Cu (2.2mil)

W = 14mil

G = 7mil

T = 2.2mil

H = 8mil

1.5oz Cu (2.2mil)

1.5oz Cu (2.2mil)

Figure 17. Probe Matrix Board Stack Up

Figure 17 shows the probe matrix board stack up, which is the

same as the ADRF5300-EVALZ, but with a different layout that

is designed to perform measurements using GSG probes at

close proximity to the RFC, RF1, and RF2 pins. Probing

reduces the reflections caused by mismatch arising from the

connectors, cables, and board layout, which results in a more

accurate measurement of the insertion loss and the return loss.

Signal coupling between the RF probes limits the isolation

measurement. Figure 18 shows the top view of the probe matrix

board layout.