ADL5920ACPZ-R2 datasheet(8/26 Pages) AD

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ADL5920

Data Sheet

Rev. B | Page 8 of 26

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (VPOS1, VPOS2, and VPOS3)

5.5 V

Negative Supply Voltage (VNEG1 and VNEG2)

−3 V

Input Average Radio Frequency (RF) Power1

50 Ω Load

33 dBm

Open or Shorted Load

30 dBm

Equivalent Voltage, Sine Wave Input

28.25 V p-p

PWDN/TADJS, TADJI, VOCM

0 V, VPOSx

VTGT

4 V

Maximum Junction Temperature

150°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

Guaranteed by design based on extended duration bench testing at 85°C

case temperature

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is junction to ambient thermal impedance, and θJC is

junction to case (exposed pad) thermal impedance.

Table 3. Thermal Resistance

Package Type1

θJA

θJC

Unit

CP-32-7

44.05

1.08

°C/W

No airflow with the exposed pad soldered to a 4-layer JEDEC board.

ESD CAUTION

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