HT83048/HT83072

Chip size: 2220

´ 2335 (mm)

2

* The IC substrate should be connected to VSS in the PCB layout artwork.

Pad Coordinates

HT83003/HT83006/HT83009

Pad No.

X

Y

Pad No.

X

Y

1

-982.145

-508.050

9

-135.205

-508.050

2

-876.845

-508.050

10

-31.229

-508.050

3

-766.245

-508.050

11

758.645

-490.400

4

-666.245

-508.050

12

858.645

-490.400

5

-555.645

-508.050

13

958.645

-490.400

6

-455.645

-508.050

14

841.895

-345.550

7

-345.045

-508.050

15

841.895

-224.050

8

-245.045

-508.050

16

841.895

-85.450

HT83018/HT83036

Pad No.

X

Y

Pad No.

X

Y

1

-982.145

-660.550

9

-135.205

-660.550

2

-876.845

-660.550

10

-31.229

-660.550

3

-766.245

-660.550

11

758.645

-642.900

4

-666.245

-660.550

12

858.645

-642.900

5

-555.645

-660.550

13

958.645

-642.900

6

-455.645

-660.550

14

841.895

-498.050

7

-345.045

-660.550

15

841.895

-376.550

8

-245.045

-660.550

16

841.895

-237.950

HT83XXX

Rev. 0.10

4

August 25, 2003

Preliminary

( 0 , 0 )

1

2

3

4

5

6

7

8

9

1 1 1 2 1 3

1 4

1 5

1 6

P W M 2

P W M 1

V D D A