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VX201700CHM3/P 数据表(PDF) 4 Page - Vishay Siliconix |
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VX201700CHM3/P 数据表(HTML) 4 Page - Vishay Siliconix |
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4 / 5 page ![]() VX20170C www.vishay.com Vishay General Semiconductor Revision: 04-Nov-2020 4 Document Number: 87172 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DIMENSIONS in millimeters (inches) TO-220AB Notes (1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Lead dimension and finish uncontrolled in L1 (3) Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Dimension b1, b3 and c1 apply to base metal only (5) Controlling dimensions: inches (6) Thermal pad contour optional within dimensions E, H1, D2 and E1 (7) Dimensions E2 x H1 define a zone where stamping and singulation irregularities are allowed (8) Outline conforms to JEDEC® TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package outline SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. A 4.25 4.65 0.167 0.183 D2 11.68 12.88 0.460 0.507 6 A1 1.14 1.40 0.045 0.055 E 10.11 10.51 0.398 0.414 3, 6 A2 2.56 2.92 0.101 0.115 E1 6.86 8.89 0.270 0.350 6 b 0.69 1.01 0.027 0.040 E2 - 0.76 - 0.030 7 b1 0.38 0.97 0.015 0.038 4 e 2.41 2.67 0.095 0.105 b2 1.20 1.73 0.047 0.068 e1 4.88 5.28 0.192 0.208 b3 1.14 1.73 0.045 0.068 4 H1 5.84 6.86 0.230 0.270 6, 7 c 0.36 0.61 0.014 0.024 L 13.52 14.02 0.532 0.552 c1 0.36 0.56 0.014 0.022 4 L1 3.32 3.82 0.131 0.150 2 D 14.85 15.25 0.585 0.600 3 Ø P 3.54 3.73 0.139 0.147 D1 8.38 9.02 0.330 0.355 Q 2.60 3.00 0.102 0.118 13 2 D D1 H1 Q 13 2 C C D D 3 x b2 3 x b (b, b2) b1, b3 (H1) D2 Detail B C A B L e1 Lead tip E E2 Ø P 0.014 A B M M 0.015 A B M M Seating plane c A2 A1 A A A Conforms to JEDEC® outline TO-220AB (6) (6) (7) (6) (7) e 2 x L1 (2) Detail B Section C - C and D - D View A - A Base metal Plating (4) (4) c1 c (6) Thermal pad (E) E1 (6) |
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