ADMV1009

Data Sheet

Rev. B | Page 4 of 23

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

VDRF

6 V

VDLO

6 V

VGLO

−2 V to 0 V

VGRF

−2 V to 0 V

VGMIX

−2 V to 0 V

Maximum Junction Temperature

175°C

Lifetime at Maximum Junction Temperature

>1 million hours

Maximum Power Dissipation

2.9 W

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Moisture Sensitivity Level (MSL) Rating

MSL3

Input Power

LO

15 dBm

IF

15 dBm

Lead Temperature Range (Soldering 60 sec)

260°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

750 V

Field Induced Charged Device Model

(FICDM)

750 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

thermal resistance, junction to case (°C/W).

Table 3.

Package Type

Unit

E-32-1

33.4

31

°C/W

1

See JEDEC standard JESD51-2 for additional information on optimal thermal

impedance (printed circuit board (PCB) within 3 × 3 vias)

ESD CAUTION