ADMV1009

Data Sheet

Rev. B | Page 20 of 23

EVALUATION BOARD INFORMATION

The circuit board used in the application must use RF circuit

design techniques. Signal lines must have 50 Ω impedance, and

the package ground leads and exposed pad must be connected

directly to the ground plane, similar to what is shown in Figure 60

and Figure 61. Use a sufficient number of via holes to connect

the top and bottom ground planes. The evaluation circuit board

shown in Figure 59 is available from Analog Devices, Inc., upon

request.

Layout

Solder the exposed pad on the underside of the ADMV1009 to

a low thermal and electrical impedance ground plane. This pad

is typically soldered to an exposed opening in the solder mask

on the evaluation board. Connect these ground vias to all other

ground layers on the evaluation board to maximize heat

dissipation from the device package. Figure 60 shows the PCB

land pattern footprint for the ADMV1009-EVALZ, and Figure 61

shows the solder paste stencil for the ADMV1009-EVALZ

evaluation board.

Power-On Sequence

To set up the ADMV1009-EVALZ, take the following steps:

1. Power up the VGLO with a −1.5 V supply.

2. Power up the VDLO with a 5 V supply.

3. Adjust VGLO from −1.5 V to −0.5 V such that IDLO =

60 mA.

4. Power up VGRF with a −1.5 V supply.

5. Power up VDRF with a 5 V supply.

6. Adjust VGRF from −1.5 V to −0.5 V such that IDLO =

250 mA

7. Power up VGMIX with a −1.5 V supply.

8. Apply an LO signal.

9. Apply an IF signal.

Power Off Sequence

To turn off the ADMV1009-EVALZ, take the following steps:

1. Turn off the LO and IF signals.

2. Set VGRF and VGLO to −1.5 V.

3. Set the VDRF and VDLO supplies to 0 V and then turn off

the VDRF and VDLO supplies.

4. Turn off the VGRF and VGLO supplies.

0.138" SQUARE MASK OPENING

0.02 × 45° CHAMFER FOR PIN 1

0.197"

[0.50]

PAD SIZE

0.026" × 0.010"

0.217" SQUARE

0.004" MASK/METAL OVERLAP

0.010" MINIMUM MASK WIDTH

0.010" REF

0.030"

MASK OPENING

0.156"

MASK

OPENING

PIN 1

GROUND PAD

SOLDER MASK

0.146" SQUARE

GROUND PAD

ø.010"

TYPICAL VIA

ø.034"

TYPICAL

VIA SPACING

Figure 60. PCB Land Pattern Footprint of the ADMV1009-EVALZ