ADMV1011

Data Sheet

Rev. A | Page 6 of 26

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

24 NIC

23 NIC

22 NIC

21 NIC

20 NIC

19 GND

18 LOIN

17 NIC

1

2

3

4

5

6

7

8

GND

RFOUT

GND

NIC

VGRF1

VCTL2

VCTL3

VGRF2

ADMV1011

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED. IT IS RECOMMENDED TO GROUND THESE PINS ON THE PCB.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED TO GND. GOOD RF AND THERMAL

GROUNDING IS RECOMMENDED.

Figure 2. Pin Configuration

Table 6. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 14, 19

GND

Ground. These pins are grounded internally and must be grounded on the PCB.

2

RFOUT

RF Output. This pin is ac-coupled internally and matched to 50 Ω single ended.

4, 10, 11, 15 to 17,

20 to 25, 27 to 30, 32

NIC

Not Internally Connected. It is recommended to ground these pins on the PCB.

5, 8

VGRF1, VGRF2

Power Supply Voltage for the Gate of the RF Amplifier. Refer to the Applications Information

section for the required external components and biasing.

6, 7

VCTL2, VCLT3

Gain Control Voltage. Refer to the Applications Information section for biasing.

9, 31

VDRF2, VDRF1

Power Supply Voltage for the RF Amplifier. Refer to the Applications Information section for

the required external components and biasing.

12, 13

IF2, IF1

Quadrature IF Inputs. These pins are matched to 50 Ω single ended and are dc-coupled. No

external dc blocks required. To prevent device malfunction or failure, these pins must not

source or sink more than 2 mA of current.

18

LOIN

Local Oscillator. This pin is ac-coupled and matched to 50 Ω single ended.

26

VDLO

Power Supply Voltage for the LO Amplifier. Refer to the external Applications Information

section for the required external components and biasing.

EPAD

Exposed Pad. The exposed pad must be connected to GND. Good RF and thermal grounding is

recommended on the PCB.