HMC260ALC3B

Data Sheet

Rev. 0 | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

RF Input Power

25 dBm

LO Input Power

27 dBm

IF Input Power

25 dBm

IF Source/Sink Current

3 mA

Peak Reflow Temperature

260°C

260 mW

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model

500 V

Field Induced Charged Device Model

1000 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

case thermal resistance.

Table 3. Thermal Resistance

Package Type

Unit

120

200

°C/W

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION