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HMC260ALC3BTR-R5 数据表(PDF) 16 Page - Analog Devices |
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HMC260ALC3BTR-R5 数据表(HTML) 16 Page - Analog Devices |
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16 / 16 page ![]() HMC260ALC3B Data Sheet Rev. 0 | Page 16 of 16 OUTLINE DIMENSIONS 0.50 BSC 0.32 BSC BOTTOM VIEW TOP VIEW SIDE VIEW 0.08 BSC 1 4 6 7 9 10 12 3 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.36 0.30 0.24 PIN 1 EXPOSED PAD PIN 1 INDICATOR 3.05 2.90 SQ 2.75 2.10 BSC 1.00 REF 1.60 1.50 SQ 1.40 0.90 0.80 0.70 SEATING PLANE Figure 42. 12-Terminal Ceramic Leadless Chip Carrier (LCC) (E-12-4) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range MSL Rating2 Package Description Package Option HMC260ALC3B −40°C to +85°C MSL3 12-Terminal LCC E-12-4 HMC260ALC3BTR −40°C to +85°C MSL3 12-Terminal LCC E-12-4 HMC260ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal LCC E-12-4 EV1HMC260ALC3B Evaluation PCB 1 All models are RoHS compliant devices. 2 The peak reflow temperature is 260°C. See Table 2 in the Absolute Maximum Ratings section. ©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13884-0-1/18(0) |
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