Data Sheet

HMC260ALC3B

Rev. 0 | Page 5 of 16

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1

GND

7

GND

PACKAGE

BASE

8

RF

9

GND

10

11

12

4

2

LO

3

GND

5

6

HMC260ALC3B

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THESE

PINS CAN BE CONNECTED TO RF/DC GROUND.

PERFORMANCE IS NOT AFFECTED.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO RF/DC GROUND.

Figure 2.

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 4, 6, 7, 9

GND

Ground. These pins and package bottoms connect to RF/dc ground.

2

LO

Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.

5

IF

Intermediate Frequency Port. This pin is dc-coupled. For applications, not requiring operation to dc, dc

block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency

range. For operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction

and possible die failure may result. See Figure 5 for the interface schematic.

8

RF

Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.

10 to 12

NIC

Not Internally Connected. These pins can be connected to RF/dc ground. Device performance is not affected.

EPAD

Exposed Pad. The exposed pad must be connected to RF/dc ground.

INTERFACE SCHEMATICS

GND

Figure 3. GND Interface Schematic

LO

Figure 4. LO Interface Schematic

IF

Figure 5. IF Interface Schematic

RF

Figure 6. RF Interface Schematic