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ISO7740, ISO7741, ISO7742

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SLLSEP4G – MARCH 2016 – REVISED FEBRUARY 2020

Product Folder Links: ISO7740 ISO7741 ISO7742

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

ISO774x

UNIT

DWW (SOIC)

DW (SOIC)

DBQ

(QSOP)

16 Pins

16 Pins

16 Pins

Junction-to-ambient thermal resistance

58.3

83.4

109

°C/W

Junction-to-case(top) thermal resistance

21.4

46

54.4

°C/W

Junction-to-board thermal resistance

30.5

48

51.9

°C/W

Junction-to-top characterization parameter

7.1

19.1

14.2

°C/W

Junction-to-board characterization parameter

29.8

47.5

51.4

°C/W

Junction-to-case(bottom) thermal resistance

—

—

—

°C/W

7.5 Power Rating

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7740

Maximum power dissipation

Input a 50-MHz 50% duty cycle square wave

200

mW

Maximum power dissipation by side-1

40

mW

Maximum power dissipation by side-2

160

mW

ISO7741

Maximum power dissipation

Input a 50-MHz 50% duty cycle square wave

200

mW

Maximum power dissipation by side-1

75

mW

Maximum power dissipation by side-2

125

mW

ISO7742

Maximum power dissipation

Input a 50-MHz 50% duty cycle square wave

200

mW

Maximum power dissipation by side-1

100

mW

Maximum power dissipation by side-2

100

mW