ISO7741FDW datasheet(26/52 Pages) TI

26 / 52 page

ISO7740, ISO7741, ISO7742

SLLSEP4G – MARCH 2016 – REVISED FEBRUARY 2020

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Product Folder Links: ISO7740 ISO7741 ISO7742

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(1)

See Safety-Related Certifications for detailed isolation ratings.

9.3 Feature Description

Table 1 provides an overview of the device features.

Table 1. Device Features

PART NUMBER

CHANNEL DIRECTION

MAXIMUM DATA

RATE

DEFAULT

OUTPUT

PACKAGE

RATED ISOLATION(1)

ISO7740

4 Forward,

0 Reverse

100 Mbps

High

DW-16

5000 VRMS / 8000 VPK

DBQ-16

3000 VRMS / 4242 VPK

ISO7740 with F

suffix

4 Forward,

0 Reverse

100 Mbps

Low

DW-16

5000 VRMS / 8000 VPK

DBQ-16

3000 VRMS / 4242 VPK

ISO7741

3 Forward,

1 Reverse

100 Mbps

High

DW-16

5000 VRMS / 8000 VPK

DBQ-16

3000 VRMS / 4242 VPK

ISO7741 with F

suffix

3 Forward,

1 Reverse

100 Mbps

Low

DW-16

5000 VRMS / 8000 VPK

DBQ-16

3000 VRMS / 4242 VPK

ISO7741B

3 Forward,

1 Reverse

100 Mbps

High

DW-16

5000 VRMS / 8000 VPK

ISO7741B with F

suffix

3 Forward,

1 Reverse

100 Mbps

Low

DW-16

5000 VRMS / 8000 VPK

ISO7742

2 Forward,

2 Reverse

100 Mbps

High

DW-16

5000 VRMS / 8000 VPK

DBQ-16

3000 VRMS / 4242 VPK

ISO7742 with F

suffix

2 Forward,

2 Reverse

100 Mbps

Low

DW-16

5000 VRMS / 8000 VPK

DBQ-16

3000 VRMS / 4242 VPK

9.3.1 Electromagnetic Compatibility (EMC) Considerations

Many applications in harsh industrial environment are sensitive to disturbances such as electrostatic discharge

(ESD), electrical fast transient (EFT), surge and electromagnetic emissions. These electromagnetic disturbances

are regulated by international standards such as IEC 61000-4-x and CISPR 22. Although system-level

performance and reliability depends, to a large extent, on the application board design and layout, the ISO774x

family of devices incorporates many chip-level design improvements for overall system robustness. Some of

these improvements include:

•

Robust ESD protection cells for input and output signal pins and inter-chip bond pads.

•

Low-resistance connectivity of ESD cells to supply and ground pins.

•

Enhanced performance of high voltage isolation capacitor for better tolerance of ESD, EFT and surge events.

•

Bigger on-chip decoupling capacitors to bypass undesirable high energy signals through a low impedance

path.

•

PMOS and NMOS devices isolated from each other by using guard rings to avoid triggering of parasitic

SCRs.

•

Reduced common mode currents across the isolation barrier by ensuring purely differential internal operation.

ISO7741FDW 数据表(PDF) 26 Page - Texas Instruments

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