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MCP4432-103E/ML 数据表(PDF) 70 Page - Microchip Technology |
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MCP4432-103E/ML 数据表(HTML) 70 Page - Microchip Technology |
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70 / 94 page  MCP443X/5X DS22267A-page 70 2010 Microchip Technology Inc. 8.6 Design Considerations In the design of a system with the MCP44XX devices, the following considerations should be taken into account: • Power Supply Considerations • Layout Considerations 8.6.1 POWER SUPPLY CONSIDERATIONS The typical application will require a bypass capacitor in order to filter high-frequency noise, which can be induced onto the power supply's traces. The bypass capacitor helps to minimize the effect of these noise sources on signal integrity. Figure 8-8 illustrates an appropriate bypass strategy. In this example, the recommended bypass capacitor value is 0.1 µF. This capacitor should be placed as close (within 4 mm) to the device power pin (VDD) as possible. The power source supplying these devices should be as clean as possible. If the application circuit has separate digital and analog power supplies, VDD and VSS should reside on the analog plane. FIGURE 8-8: Typical Microcontroller Connections. 8.6.2 LAYOUT CONSIDERATIONS Several layout considerations may be applicable to your application. These may include: • Noise • Footprint Compatibility • PCB Area Requirements 8.6.2.1 Noise Inductively-coupled AC transients and digital switching noise can degrade the input and output signal integrity, potentially masking the MCP44XX’s performance. Careful board layout minimizes these effects and increases the Signal-to-Noise Ratio (SNR). Multi-layer boards utilizing a low-inductance ground plane, isolated inputs, isolated outputs and proper decoupling are critical to achieving the performance that the silicon is capable of providing. Particularly harsh environments may require shielding of critical signals. If low noise is desired, breadboards and wire-wrapped boards are not recommended. 8.6.2.2 Footprint Compatibility The specification of the MCP44XX pinouts was done to allow systems to be designed to easily support the use of either the dual (MCP46XX) or quad (MCP44XX) device. Figure 8-9 shows how the dual pinout devices fit on the quad device footprint. For the Rheostat devices, the dual device is in the MSOP package, so the footprints would need to be offset from each other. FIGURE 8-9: Quad Pinout (TSSOP Package) vs. Dual Pinout. VDD VDD VSS VSS 0.1 µF 0.1 µF SCL HVC/A0 W B A SDA A1 1 2 3 4 17 18 19 20 RESET A1 WP VDD MCP44X1 Quad Potentiometers TSSOP 5 6 7 14 15 16 P0W P0B P0A P1A P1W P1B VSS HVC/A0 SDA SCL MCP44X2 Quad Rheostat 1 2 3 4 11 12 13 14 P0B A1 P0W VDD TSSOP 5 6 7 8 9 10 P2W P1W P2B P3B P3W P1B VSS HVC/A0 SDA SCL 8 9 10 P3B P3W P3A 12 12 P2W P2A P2B 11 MCP42X1 Pinout (1) MCP42X2 Pinout Note 1: Pin 15 (RESET) is the Address A2 (A2) pin on the MCP46x1 device. |
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