MCP4432-103ESLASHML datasheet(71/94 Pages) MICROCHIP

71 / 94 page

 2010 Microchip Technology Inc.

DS22267A-page 71

MCP443X/5X

Figure 8-10 shows possible layout implementations for

an application to support the quad and dual options on

the same PCB.

FIGURE 8-10:

Layout to Support Quad and

Dual Devices.

8.6.2.3

PCB Area Requirements

In some applications, PCB area is a criteria for device

selection. Table 8-2 shows the package dimensions

and area for the different package options. The table

also shows the relative area factor compared to the

smallest area. For space critical applications, the QFN

package would be the suggested package.

TABLE 8-2:

PACKAGE FOOTPRINT (1)

8.6.3

RESISTOR TEMPCO

Characterization curves of the resistor temperature

coefficient (Tempco) are shown in Figure 2-11,

Figure 2-32, Figure 2-52, and Figure 2-72.

These curves show that the resistor network is

designed to correct for the change in resistance as

temperature increases. This technique reduces the

end to end change is RAB resistance.

8.6.4

HIGH VOLTAGE TOLERANT PINS

High Voltage support (VIHH) on the Serial Interface pins

is for compatibility with the non-volatile devices.

Potentiometers Devices

Rheostat Devices

MCP44X1

MCP46X1

MCP44X2

MCP46X2

Package

Package Footprint

Type

Code

Dimensions

(mm)

14 TSSOP

5.10

6.40 32.64 2.04

QFN

4.00

4.00 16.00

TSSOP

6.60

6.40 42.24 2.64

Note 1: Does not include recommended land

pattern dimensions.

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