MODEL: R3-ND2

R3-ND2 SPECIFICATIONS

ES-8381 Rev.20 Page 2/7

https://www.m-system.co.jp/

DeviceNet COMMUNICATION

Transmission cable: Approved for DeviceNet

Node address setting: DIP switch; 00 – 63

Baud rate: 125 kbps, 250 kbps, 500 kbps DIP switch

NS (Network Status) indicator: Bi-color (green/red) LED

indicates status of the communication link.

MS (Module Status) indicator: Bi-color (green/red) LED

indicates device status.

Data allocation: 32 words for input data 35 words for output

data

INSTALLATION

Power consumption

•AC: Approx. 20 VA

•DC: Approx. 12 W

Current consumption (no power supply): 80 mA

Output current (power supply): 270 mA continuous at 20 V

DC; 420 mA for 10 minutes

Supply voltage to network: 11 – 25 V DC supplied through

the network terminal block

Supply current to network: 50 mA max.

Operating temperature: -10 to +55°C (14 to 131°F)

Operating humidity: 30 to 90 %RH (non-condensing)

Atmosphere: No corrosive gas or heavy dust

Mounting: Installation Base (model: R3-BSx)

Weight: 200 g (0.44 lb)

PERFORMANCE

Insulation resistance: ≥ 100 MΩ with 500 V DC

Dielectric strength: 1500 V AC @ 1 minute

(DeviceNet to internal bus or internal power to power input

to RUN contact output to FG)

STANDARDS & APPROVALS

EU conformity:

EMC Directive

EMI EN 61000-6-4

EMS EN 61000-6-2

RoHS Directive