SCIMX356BVMB datasheet(21/147 Pages) NXP

21 / 147 page

i.MX35 Applications Processors for Automotive Products, Rev. 10

Freescale Semiconductor

4.7

I/O Pin DC Electrical Characteristics

I/O pins are of two types: GPIO and DDR. DDR pins can be configured in three different drive strength

modes: mobile DDR, SDRAM, and DDR2. The SDRAM and mobile DDR modes can be further

customized at three drive strength levels: normal, high, and max.

Table 13 shows currents for the different DDR pin drive strength modes.

Junction to ambient1 (at 200 ft/min)

Single layer board (1s)

ReJMA

ºC/W

Junction to ambient1 (at 200 ft/min)

Four layer board (2s2p)

ReJMA

ºC/W

Junction to boards2

—ReJB

ºC/W

Junction to case (top)3

—ReJCtop

ºC/W

Junction to package top4

Natural convection

2ºC/W

1 Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC

specification for this package.

2 Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for this

package.

3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used

for the case temperature. Reported value includes the thermal resistance of the interface layer.

4 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written

as Psi-JT.

Table 13. DDR Pin Drive Strength Mode Current Levels

Drive Mode

Normal

High

Max.

Mobile DDR (1.8 V)

3.6 mA

7.2 mA

10.8 mA

SDRAM (1.8 V)

—

6.5 mA

SDRAM (3.3 V)

4 mA

8 mA

12 mA

DDR2 (1.8 V)

—

13.4 mA

Table 12. Thermal Resistance Data (continued)

Rating

Condition

Symbol

Value

Unit

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