Data Sheet

ADCLK914

Rev. B | Page 11 of 11

OUTLINE DIMENSIONS

0.30

0.23

0.18

1.75

1.60 SQ

1.45

3.10

3.00 SQ

2.90

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

0.50

0.40

0.30

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT

TO JEDEC STANDARDS MO-220-WEED-6.

SEATING

PLANE

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 20. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-16-22)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADCLK914BCPZ-WP

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-22

ADCLK914BCPZ-R7

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-22

ADCLK914BCPZ-R2

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-22

ADCLK914/PCBZ

Evaluation Board

©2008–2017 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D06561-0-9/17(B)