TL082ACDR datasheet(12/75 Pages) TI

12 / 75 page

6.8 Thermal Information for Dual Channel: TL082H (continued)

THERMAL METRIC (1)

TL082H

UNIT

(SOIC)

DDF

(SOT-23)

(TSSOP)

8 PINS

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.9 Thermal Information for Quad Channel: TL084H

THERMAL METRIC (1)

TL084H

UNIT

(SOIC)

DYY (2)

(SOT-23)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

114.2

TBD

134.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

70.3

TBD

62.6

°C/W

RθJB

Junction-to-board thermal resistance

70.2

TBD

77.6

°C/W

ψJT

Junction-to-top characterization parameter

28.8

TBD

13.0

°C/W

ψJB

Junction-to-board characterization parameter

69.8

TBD

77.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

TBD

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TL084H.

6.10 Thermal Information: All Other Devices

THERMAL METRIC(1)

TL08xxx

UNIT

D (SOIC)

(LCCC)

J (CDIP)

N (PDIP)

NS (SO)

PW (TSSOP)

8 PIN

14 PIN

20 PIN

8 PIN

14 PIN

8 PIN

14 PIN

8 PIN

14 PIN

8 PIN

14 PIN

RθJA

Junction-to-

ambient thermal

resistance

150

113

°C/W

RθJC(top)

Junction-to-

case (top)

thermal

resistance

5.61

15.05

14.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

TL081, TL081A, TL081B, TL081H

TL082, TL082A, TL082B, TL082H

TL084, TL084A, TL084B, TL084H

SLOS081L – FEBRUARY 1977 – REVISED JULY 2021

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Product Folder Links: TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B

TL084H

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