Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................4

6 Specifications................................................................ 10

6.1 Absolute Maximum Ratings: TL08xH .......................10

6.2 Absolute Maximum Ratings: All Other Devices........ 10

6.3 ESD Ratings: TL08xH ..............................................10

6.4 ESD Ratings: All Other Devices................................11

6.5 Recommended Operating Conditions: TL08xH ....... 11

6.6 Recommended Operating Conditions: All Other

Devices........................................................................11

6.7 Thermal Information for Single Channel: TL081H ....11

6.8 Thermal Information for Dual Channel: TL082H ...... 11

6.9 Thermal Information for Quad Channel: TL084H .....12

6.10 Thermal Information: All Other Devices.................. 12

6.11 Electrical Characteristics: TL08xH ......................... 13

6.12 Electrical Characteristics for TL08xC, TL08xxC,

and TL08xI.................................................................. 15

6.13 Electrical Characteristics for TL08xM and

TL084x........................................................................ 16

6.14 Switching Characteristics........................................17

6.15 Dissipation Rating Table......................................... 17

6.16 Typical Characteristics: TL08xH............................. 18

6.17 Typical Characteristics: All Other Devices.............. 25

7 Parameter Measurement Information.......................... 28

8 Detailed Description......................................................29

8.1 Overview................................................................... 29

8.2 Functional Block Diagram......................................... 29

8.3 Feature Description...................................................29

8.4 Device Functional Modes..........................................30

9 Applications and Implementation................................ 31

9.1 Application Information............................................. 31

9.2 Typical Applications.................................................. 31

9.3 System Examples..................................................... 32

10 Power Supply Recommendations..............................34

11 Layout........................................................................... 35

11.1 Layout Guidelines................................................... 35

11.2 Layout Examples.....................................................35

12 Device and Documentation Support..........................36

12.1 Receiving Notification of Documentation Updates..36

12.2 Support Resources................................................. 36

12.3 Trademarks.............................................................36

12.4 Electrostatic Discharge Caution..............................36

12.5 Glossary..................................................................36

13 Mechanical, Packaging, and Orderable

Information.................................................................... 36

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision K (June 2021) to Revision L (July 2021)

Page

• Deleted preview note from TL081H SOIC (8), SOT-23 (5), and SC70 (5) packages throughout the data sheet

............................................................................................................................................................................1

Changes from Revision J (November 2020) to Revision K (June 2021)

Page

• Deleted VSSOP (8) package references throughout data sheet........................................................................ 1

• Deleted preview note from TL082H SOIC (8), SOT-23 (8), and TSSOP (8) packages throughout the data

sheet................................................................................................................................................................... 1

• Added DBV, DCK, and D packages to TL081H in Pin Configuration and Functions section..............................4

• Added ESD information for TL082H................................................................................................................. 10

• Added D, DCK, and DBV package thermal information in Thermal Information for Single Channel: TL081H

section...............................................................................................................................................................11

• Added D, DDF, and PW package thermal information in Thermal Information for Dual Channel: TL082H

section ..............................................................................................................................................................11

• Removed Related Links section from Device and Documentation Support section.........................................36

Changes from Revision I (May 2015) to Revision J (November 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added TL08xH devices throughout the data sheet.............................................................................................1

• Added features for TL08xH to the Features section........................................................................................... 1

• Added link to applications in the Applications section........................................................................................ 1

TL081, TL081A, TL081B, TL081H

TL082, TL082A, TL082B, TL082H

TL084, TL084A, TL084B, TL084H

SLOS081L – FEBRUARY 1977 – REVISED JULY 2021

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