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FDPC8014AS 数据表(PDF) 4 Page - ON Semiconductor |
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FDPC8014AS 数据表(HTML) 4 Page - ON Semiconductor |
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4 / 12 page ![]() FDPC8014AS www.onsemi.com 4 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) (continued) Symbol Unit Max Typ Min Type Test Condition Parameter DRAIN−SOURCE DIODE CHARACTERISTICS VSD Source to Drain Diode Forward Voltage VGS = 0 V, IS = 20 A (Note 6) VGS = 0 V, IS = 40 A (Note 6) Q1 Q2 − − 0.8 0.8 1.2 1.2 V IS Diode Continuous Forward Current TC = 25°C Q1 Q2 − − 59 159 − − A IS,Pulse Diode Pulse Current Q1 Q2 − − 266 1116 − − A trr Reverse Recovery Time Q1: IF = 20 A, di/dt = 100 A/ms Q2: IF = 40 A, di/dt = 300 A/ms Q1 Q2 − − 25 44 40 70 ns Qrr Reverse Recovery Charge Q1 Q2 − − 10 78 20 125 nC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Pulse Test: Pulse Width < 300 ms, Duty cycle < 2.0%. TYPICAL CHARACTERISTICS (Q1 N−CHANNEL) (TJ = 25°C unless otherwise noted) 0.0 0.2 0.4 0.6 0.8 1.0 0 15 30 45 60 75 VGS = 3.5 V VGS = 3 V PULSE DURATION = 80 ms DUTY CIRCLE = 0.5% MAX VGS = 2.5 V VGS = 10 V VDS, DRAIN TO SOURCE VOLTAGE (V) VGS = 4.5 V 015 30 45 60 0 1 2 3 4 5 VGS = 3 V ID, DRAIN CURRENT (A) VGS= 3.5 V VGS = 4.5 V VGS = 2.5 V VGS= 10 V −75 −50 −25 0 25 50 75 100 125 0 15 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 ID = 20 A VGS = 10 V TJ, JUNCTION TEMPERATURE (°C) 14 5 6 0 3 6 9 12 TJ = 125°C ID = 20 A VGS, GATE TO SOURCE VOLTAGE (V) Figure 1. On Region Characteristics Figure 2. Normalized On−Resistance vs. Drain Current and Gate Voltage Figure 3. Normalized On Resistance vs. Junction Temperature Figure 4. On−Resistance vs. Gate to Source Voltage PULSE DURATION = 80 ms DUTY CIRCLE = 0.5% MAX 75 PULSE DURATION = 80 ms DUTY CIRCLE = 0.5% MAX TJ = 25°C 23 8 9 10 7 |
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