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STM32F373C8 数据表(PDF) 58 Page - STMicroelectronics

部件名 STM32F373C8
功能描述  ARM® Cortex®-M4 32b MCUFPU, up to 256KB Flash32KB SRAM, timers, 4 ADCs (16-bit Sig. Delta / 12-bit SAR), 3 DACs, 2 comp., 2.0-3.6 V
PDF  137 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F373C8 数据表(HTML) 58 Page - STMicroelectronics

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Electrical characteristics
STM32F373xx
58/137
DocID022691 Rev 7
6.3.2
Operating conditions at power-up / power-down
The parameters given in Table 23 are derived from tests performed under the ambient
temperature condition summarized in Table 22.
TA
Ambient temperature for 6 suffix
version
Maximum power dissipation
–40
85
°C
Low power dissipation(5)
–40
105
Ambient temperature for 7 suffix
version
Maximum power dissipation
–40
105
°C
Low power dissipation(5)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125
1. When the ADC is used, refer to Table 60: ADC characteristics.
2. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.
3. VDDSD12 is the external power supply for the PB2, PB10, and PE7 to PE15 I/O pins (the I/O pin ground is internally
connected to VSS). VDDSD3 is the external power supply for PB14 to PB15 and PD8 to PD15 I/O pins (the I/O pin ground
is internally connected to VSS).
4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
5. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.
Table 22. General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Table 23. Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
-
0
µs/V
VDD fall time rate
20
tVDDA
VDDA rise time rate
-
0
VDDA fall time rate
20



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