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STM32F373C8 数据表(PDF) 135 Page - STMicroelectronics |
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STM32F373C8 数据表(HTML) 135 Page - STMicroelectronics |
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135 / 137 page ![]() DocID022691 Rev 7 135/137 STM32F373xx Revision history 136 18-Mar-2014 5 Renamed part number STM32F37x to STM32F373xx Added note1 in Table 28: Typical and maximum current consumption from VDD supply at VDD = 3.6 V Updated Chapter 3.14: Digital-to-analog converter (DAC) Updated, added note 2 and 3 in Table 57: I2C analog filter characteristics Renamed tSP symbol with tAF. Added note for EG Symbol in Table 74: SDADC characteristics Added all packages top view 21-Jul-2015 6 Updated Section 7 Updated Section 3.13 Updated Section 3.7.1, Section 3.7.4 Updated Table 11: STM32F373xx pin definitions, Table 19: Voltage characteristics, Table 49: ESD absolute maximum ratings, Table 74: SDADC characteristics, Table 76: UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data, and Table 78: LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat package mechanical data Updated Figure 2: STM32F373xx LQFP48 pinout, Figure 9: Power supply scheme, Figure 32: UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package outline, Figure 34: UFBGA100 marking example (package top view), Figure 36: LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat recommended footprint, Figure 37: LQFP100 marking example (package top view), Figure 38: LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline, Figure 39: LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package recommended footprint, Figure 40: LQFP64 marking example (package top view), Figure 42: LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package recommended footprint, Figure 43: LQFP48 marking example (package top view). Added Table 32: Typical and maximum current consumption from VBAT supply, Table 49: ESD absolute maximum ratings, Table 64: Comparator characteristics, Table 77: UFBGA100 recommended PCB design rules (0.5 mm pitch BGA). Added Figure 11: Typical VBAT current consumption (LSE and RTC ON/LSEDRV[1:0]='00'), Figure 30: Maximum VREFINT scaler startup time from power down, Figure 33: UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint. Table 83. Document revision history (continued) Date Revision Changes |
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