MPC5602BAMLL4R datasheet(37/109 Pages) NXP

37 / 109 page

Package pinouts and signal descriptions

MPC5604B/C Microcontroller Data Sheet, Rev. 15

NXP Semiconductors

2.14.2

Power considerations

The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:

TJ = TA + (PD x RθJA)

Eqn. 1

Where:

TA is the ambient temperature in °C.

RθJA is the package junction-to-ambient thermal resistance, in °C/W.

PD is the sum of PINT and PI/O (PD = PINT + PI/O).

PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power.

PI/O represents the power dissipation on input and output pins; user determined.

Most of the time for the applications, PI/O< PINT and may be neglected. On the other hand, PI/O may be

significant, if the device is configured to continuously drive external modules and/or memories.

An approximate relationship between PD and TJ (if PI/O is neglected) is given by:

PD = K / (TJ + 273 °C)

Eqn. 2

Therefore, solving equations 1 and 2:

K = PD x (TA + 273 °C) + RθJA x PD

Eqn. 3

Where:

ΨJC CC

Junction-to-case thermal

characterization parameter,

natural convection

Single-layer board - 1s

TBD

°C/W

100

144

Four-layer board - 2s2p

TBD

100

144

1 Thermal characteristics are based on simulation.

2 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C

3 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test

board meets JEDEC specification for this package.

4 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

5 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface

layer.

Table 14. LQFP thermal characteristics1 (continued)

Symbol

Parameter

Conditions2

Pin count

Value

Unit

MPC5602BAMLL4R 数据表(PDF) 37 Page - NXP Semiconductors

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