MPC5602BAMLL4R datasheet(99/109 Pages) NXP

99 / 109 page

Ordering information

MPC5604B/C Microcontroller Data Sheet, Rev. 15

NXP Semiconductors

Ordering information

Figure 45. Commercial product code structure

1 208 MAPBGA available only as development package for Nexus2+

Document revision history

Table 49 summarizes revisions to this document.

Table 49. Revision history

Revision

Date

Description of Changes

04-Apr-2008

Initial release.

Qualification Status

PowerPC Core

Automotive Platform

Core Version

Flash Size (core dependent)

Product

Temperature spec.

MPC

Example code:

Package Code

Frequency

Qualification Status

M = MC status

S = Auto qualified

P = PC status

Automotive Platform

56 = PPC in 90nm

Core Version

0 = e200z0

Flash Size (z0 core)

2 = 256 KB

3 = 384 KB

4 = 512 KB

Product

B = Body

C = Gateway

Fab and Mask Indicator

F = ATMC Fab

K = TSMC Fab

A = ATMC Fab or TSMC Fab

Second digit usually differentiate mask rev

R = Tape & Reel (blank if Tray)

Temperature spec.

C =

−40 to 85 °C

V =

−40 to 105 °C

M =

−40 to 125 °C

Package Code

LH = 64 LQFP

LL = 100 LQFP

LQ = 144 LQFP

MG = 208 MAPBGA1

Frequency

4 = Up to 48 MHz

6 = Up to 64 MHz

Fab and Mask Indicator

Note: Not all options are available on all devices.

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