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2022 Microchip Technology Inc. and its subsidiaries

DS20006670A-page 11

PL133-47

8-Lead SOIC Package Outline and Recommended Land Pattern

© 2020 Microchip Technology Incorporated

0.25

C A–B D

C

SEATING

PLANE

TOP VIEW

SIDE VIEW

VIEW A–A

0.10 C

0.10 C

Microchip Technology Drawing No. C04-057-MSB Rev F Sheet 1 of 2

8X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

8-Lead Plastic Small Outline (MSB) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Atmel Legacy Global Package Code SWB

1

2

N

h

h

A1

A2

A

A

B

e

D

E

E

2

E1

2

E1

NOTE 5

NOTE 5

NX b

0.10 C A–B

2X

H

0.23

(L1)

L

R0.13

R0.13

VIEW C

SEE VIEW C

NOTE 1

D

0.10 C A–B

2X

0.10 C A–B

2X