PL133-47

DS20006670A-page 12

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2022 Microchip Technology Inc. and its subsidiaries

8-Lead SOIC Package Outline and Recommended Land Pattern

© 2020 Microchip Technology Incorporated

Microchip Technology Drawing No. C04-057-MSB Rev F Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Foot Angle

0°

-

8°

15°

-

5°

Mold Draft Angle Bottom

15°

-

5°

Mold Draft Angle Top

0.51

-

0.31

b

Lead Width

0.25

-

0.17

c

Lead Thickness

1.27

-

0.40

L

Foot Length

0.50

-

0.25

h

Chamfer (Optional)

4.90 BSC

D

Overall Length

3.90 BSC

E1

Molded Package Width

6.00 BSC

E

Overall Width

0.25

-

0.10

A1

Standoff

-

-

1.25

A2

Molded Package Thickness

1.75

-

-

A

Overall Height

1.27 BSC

e

Pitch

8

N

Number of Pins

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

Units

protrusions shall not exceed 0.15mm per side.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic

4. Dimensioning and tolerancing per ASME Y14.5M

Notes:

§

Footprint

L1

1.04 REF

5. Datums A & B to be determined at Datum H.

8-Lead Plastic Small Outline (MSB) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Atmel Legacy Global Package Code SWB