BLF978P

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© Ampleon Netherlands B.V. 2020. All rights reserved.

Product data sheet

Rev. 1 — 3 April 2020

7 of 15

BLF978P

HF / VHF power LDMOS transistor

8.3 Test circuit

Printed-Circuit Board (PCB): Rogers RT/duroid 5880; thickness = 0.79 mm.

See Table 10 for a list of components.

Fig 8.

Component layout for class-AB production test circuit

amp01283

C22

B3

C15

C13

C1

C2

C3

C5

C7

B2

C4

C6

C8

R1

R2

C14

C16

C20

C21

C17

C9

C11

C10

C12

B1

B4

C18

C19

L1

L2

R3

R4

200.3 mm

90 mm

17 mm

1.6 mm

2 mm

5 mm

5 mm

10.5 mm

Table 10.

List of components

For test circuit see Figure 8.

Component

Description

Value

Remarks

C1, C7, C8, C9, C10, C22

multilayer ceramic chip capacitor

1 nF

ATC 100B

C2, C3

multilayer ceramic chip capacitor

62 pF

ATC 100B

C4

multilayer ceramic chip capacitor

111 pF

ATC 100B

C5, C6, C11, C12

multilayer ceramic chip capacitor

4.7

F, 100 V

C3225X7S2A475K200AE

C13, C14, C20, C21

multilayer ceramic chip capacitor

47 pF

ATC 100B

C15, C16

multilayer ceramic chip capacitor

43 pF

ATC 100B

C17

multilayer ceramic chip capacitor

51 pF

ATC 100B

C18, C19

electrolytic capacitor

1500

F, 80 V

L1, L2

air core inductor

17.5 nH

B06TJLB

R1, R2

SMD resistor

5.1



SMD 1206

R3, R4

shunt resistor

0.01



Ohmite: FC4L110R010FER

B1, B2, B3, B4

coaxial line

50

, 58 mm

HUBER+SUHNER:

EZ-141-AL-TP-M17