28 GHz 5G Medium Power Amplifier (MPA)

CMX90A702

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Page 14

D/90A702/1 June 2022

PCB Layout

Careful layout of the printed circuit board (PCB) is essential for optimum RF and thermal performance. The

recommended layout, including ground via pattern underneath the device, may be taken from the evaluation board

(Part Number EV90A702).

The PCB is a single layer of R04003, 8 thou thickness with ½ copper mounted to aluminium carrier with Ablefilm

adhesive (0.05mm thick CF3350) which provides rigidity and thermal dissipation (Figure 47) and the EV90A702 PCB

(Figure 48) is 26 mm x 46 mm. The coplanar RF transmission lines have a width of 0.33 mm with a gap of 0.21 mm to

ground either side.

0.203 mm

Solder Mask

Ablefilm

RO4003C

Aluminium

Carrier

Figure 47: EV90A702 Layer Stack

Figure 48: EV90A702 PCB Top Layer View