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AM6411...ALV 数据表(PDF) 110 Page - Texas Instruments |
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AM6411...ALV 数据表(HTML) 110 Page - Texas Instruments |
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110 / 244 page ![]() 7.9 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the device has to be at or below the TJ value identified in Recommended Operating Conditions. 7.9.1 Thermal Resistance Characteristics Table 7-2. ALV Package Thermal Resistance Characteristics It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. PARAMETER DESCRIPTION °C/W(1) (3) AIR FLOW (m/s)(2) ALV Package T1 RΘJC Junction-to-case 0.98 N/A T2 RΘJB Junction-to-board 3.87 N/A T3 RΘJA Junction-to-free air 12.8 0 T4 RΘJA Junction-to-moving air 9.2 1 T5 8.2 2 T6 7.6 3 T7 ΨJT Junction-to-package top 0.53 0 T8 0.55 1 T9 0.57 2 T10 0.58 3 T11 ΨJB Junction-to-board 3.74 0 T12 3.5 1 T13 3.4 2 T14 3.3 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages (2) m/s = meters per second. (3) °C/W = degrees Celsius per watt. AM6442, AM6441, AM6421, AM6412, AM6411 SPRSP56D – JANUARY 2021 – REVISED JULY 2022 www.ti.com 110 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: AM6442 AM6441 AM6421 AM6412 AM6411 |
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