OPA310 datasheet(31/55 Pages) TI

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8.3.9 Shutdown Function

The OPAx310 S devices feature SHDN pins that disable the op amp, placing the op amp into a low-power

standby mode. In this mode, the op amp typically consumes less than 500-nA at room temperature. The SHDN

pins are active low, meaning that shutdown mode is enabled when the input to the SHDN pin is a valid logic low.

The SHDN pins are referenced to the negative supply voltage of the op amp. The threshold of the shutdown

feature lies around 500-mV (typical) and does not change with respect to the supply voltage. Hysteresis has

been included in the switching threshold to provide for smooth switching characteristics. To make sure of optimal

shutdown behavior, the SHDN pins must be driven with valid logic signals. A valid logic low is defined as a

voltage between V– and (V–) + 0.2 V. A valid logic high is defined as a voltage between (V–) + 1.2 V and V+. To

enable the amplifier, the SHDN pins must be driven to a valid logic high. To disable the amplifier, the SHDN pins

must be driven to a valid logic low. TI highly recommends that the shutdown pin be connected to a valid high or

a low voltage or driven. The maximum voltage allowed at the SHDN pins is (V+) + 0.5 V. Exceeding this voltage

level damages the device.

The SHDN pins are high-impedance CMOS inputs. Dual op amp versions are independently controlled and quad

op amp versions are controlled in pairs with logic inputs. For battery-operated applications, this feature can be

used to greatly reduce the average current and extend battery life. The enable and disable time is targeted to be

under 1-µs for full shutdown of all channels. When disabled, the output assumes a high-impedance state. This

architecture allows the OPAx310S to be operated as a gated amplifier (or to have the device output multiplexed

onto a common analog output bus). Shutdown time (tOFF) depends on loading conditions and increases as load

resistance increases. To make sure that shutdown (disable) is within a specific shutdown time, the specified

10-kΩ load to midsupply (VS / 2) is required.

8.3.10 Packages with an Exposed Thermal Pad

The OPAx310 family is available in packages such as the WQFN-16 (RTE), which feature an exposed thermal

pad. Inside the package, the die is attached to this thermal pad using an electrically conductive compound. For

this reason, when using a package with an exposed thermal pad, the thermal pad must be connected to (V–).

Attaching the thermal pad to a potential other then (V–) is not allowed, and the performance of the device is not

assured when doing so.

8.4 Device Functional Modes

The OPAx310 devices have one functional mode. These devices are powered on as long as the power-supply

voltage is between 1.5 V (±0.75 V) and 5.5 V (±2.75 V).

The OPAx310S devices feature a shutdown pin, which can be used to place the op amp into a low-power mode.

See Shutdown Function for more information.

www.ti.com

OPA310, OPA2310, OPA4310

SBOSAA1C – APRIL 2022 – REVISED SEPTEMBER 2022

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