STGAP2SICS datasheet(4/22 Pages) STMICROELECTRONICS

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Electrical data

3.1

Absolute maximum ratings

Table 2. Absolute maximum ratings

Symbol

Parameter

Test

condition

Min.

Max.

Unit

VDD

Logic supply voltage vs. GND

-0.3

6.5

VLOGIC Logic pins voltage vs. GND

-0.3

6.5

Positive supply voltage (VH vs. GNDISO)

-0.3

VOUT

Voltage on gate driver outputs (GON, GOFF, CLAMP VS. GNDISO)

-0.3

VH+0.3

Junction temperature

-40

150

°C

Storage temperature

-50

150

°C

ESD

HBM (human body model)

3.2

Thermal data

Table 3. Thermal data

Symbol

Parameter

Package

Value

Unit

Rth(JA)

Thermal resistance junction to ambient

SO-8W

120

°C/W

3.3

Recommended operating conditions

Table 4. Recommended operating conditions

Symbol

Parameter

Test conditions

Min.

Max.

Unit

VDD

Logic supply voltage vs. GND

3.1

5.5

VLOGIC

Logic pins voltage vs. GND

5.5

Positive supply voltage (VH vs. GNDISO)

Max(VHON)

FSW

Maximum switching frequency(1)

MHz

tOUT

Output pulse width (GOUT, GON-GOFF)

100

Operating Junction Temperature

-40

125

°C

1. Actual limit depends on power dissipation and TJ.

STGAP2SICS

Electrical data

DS13402 - Rev 4

page 4/22

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