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PTH12010x

(Top View)

1

2

10

7

6

5

4

3

Margin Up

Margin Down

L

O

A

D

C

560 F

(Required)

I

m

R

,1%

(Required)

SET

C

330 F

(Optional)

O

m

Inhibit

GND

GND

Track

98

ABSOLUTE MAXIMUM RATINGS

PTH12010W, PTH12010L

SLTS205E–JUNE 2003–REVISED APRIL 2006

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

STANDARD APPLICATION

for values).

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

Voltages are with respect to GND

MIN TYP

MAX UNIT

Track Input Voltage

–0.3

V

Operating Temperature

85

°C

Range

Wave solder

Surface temperature of module body or pins

PTH12010WAH

temperature

(5 seconds)

°C

PTH12010WAS

Solder reflow

Surface temperature of module body or pins

temperature

PTH12010WAZ

Storage Temperature

–40

125

°C

Mechanical Shock

Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 Sine, mounted

500

G

Mechanical Vibration

Mil-STD-883D, Method 2007.2

20

G

20-2000 Hz

Weight

5

grams

Flammability

Meets UL 94V-O

(1) For operation below 0°C the external capacitors must have stable characteristics. Use either a low-ESR tantalum, Os-Con, or ceramic

capacitor.

(2) During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated

maximum.

2

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