KTB8331

December 2021

– Revision 04b

Page 3 of 25

Kinetic Confidential

Absolute Maximum Ratings1

(TA = 25

C unless otherwise noted)

Symbol

Description

Value

Units

VIN

VIN to AGND

-0.3 to 6

V

VPGND

PGND to AGND

-0.3 to 0.3

V

VLX2

LX to PGND

-0.3 to (VIN+0.3)

V

VOUT

VOUT to AGND

-0.3 to (VIN+0.3)

V

VIO

SCL, SDA, VSEL to AGND

-0.3 to 6

V

EN,

IRQ

̅̅̅̅̅̅ to AGND

-0.3 to VIN

V

ILX

LX Continuous Current

3.2

ARMS

LX Peak Current (1ms maximum)

9.6

APEAK

TJ

Operating Junction Temperature Range

-40 to 150

C

TS

Storage Temperature Range

-55 to 150

C

TLEAD

Maximum Soldering Temperature (at leads, 10 sec)

260

C

ESD Ratings3

Symbol

Description

Value

Units

VESD_HBM

JEDEC JS-001-2017 ESD Human Body Model (all pins)

±2

kV

Thermal Capabilities4

Symbol

Description

Value

Units

ΘJA

Thermal Resistance

– Junction to Ambient

77

C/W

PD

Maximum Power Dissipation at TA = 25°C

1.62

W

ΔPD/ΔT

Derating Factor Above TA = 25°C

-13

mW/°C

1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions

other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one time.

2. Absolute Maximum Rating for VLX is a DC voltage rating. During normal switching operation, short-duration voltage spikes beyond the DC

rating are expected and normal for all DC-DC switching regulators.

3. ESD Ratings conform to JEDEC industry standards. Some pins may actually have higher performance.

4. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the device when

soldered to an EV board.