KTB8331

December 2021

– Revision 04b

Page 25 of 25

Kinetic Confidential

Packaging Information

WLCSP35-15 (1.340mm x 2.045mm x 0.620mm)

4x

0.400mm

2x

0.400mm

15x

0.27mm Ø

±0.027mm

1.340mm

±0.050mm

2.045mm

±0.050mm

0.215mm

±0.022mm

0.620mm

±0.045mm

0.025mm

±0.003mm

Bottom View

Side View

Top View

Top Side Die Coating

A1 Corner

Recommended Footprint

1.60mm

0.80mm

0.22mm

Copper Pad

Diameter

0.40mm

0.40mm

(NSMD Pad Type)

0.32mm

Solder Mask

Opening

Kinetic Technologies cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Kinetic Technologies

product. No intellectual property or circuit patent licenses are implied. Kinetic Technologies reserves the right to change the circuitry and

specifications without notice at any time.