Data Sheet

ADRF5141

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 13

For recommended operating conditions, see Table 1.

Table 2. Absolute Maximum Ratings

Parameter

Rating

VDD

−0.3 V to +3.6 V

VSS

−3.6 V to +0.3 V

Digital Control Input

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Power

Input at TX1 (f = 8 GHz to 11 GHz, TCASE = 85°C2)

Continuous Wave

36.5 dBm

Pulsed (5% duty cycle, >100 ns pulse width,

TCASE = 85°C)

40.5 dBm

Pulsed (15% duty cycle, >100 ns pulse width,

TCASE = 50°C)

40.5 dBm

Peak

43.5 dBm

Input at ANT (f = 6 GHz to 12 GHz, TCASE = 85°C2)

Continuous Wave

33.5 dBm

Pulsed (5% duty cycle, >100 ns pulse width,

TCASE = 85°C)

40.5 dBm

Pulsed (15% duty cycle, >100 ns pulse width,

TCASE = 50°C)

40.5 dBm

Peak

40.5 dBm

RF Power Under Unbiased Condition (VDD and VSS =

0 V)

Input at ANT

33 dBm

Temperature

Junction, TJ

135°C

Storage

−65°C to +150°C

Reflow

260°C

1 For power derating vs. frequency for the input at TX, see Figure 2.

2 For 105°C operation, the power handling degrades from the TCASE = 85°C

specifications by 3 dB.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to package bottom)

thermal resistance.

Table 3. Thermal Resistance

Package Type

θJC1

Unit

CC-20-9

Table 3. Thermal Resistance

Package Type

θJC1

Unit

TX Path

45

°C/W

RX Path

28.6

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to the thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVE

Figure 2. Power Derating vs. Frequency for Input at TX, TCASE = 85°C

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADRF5141

Table 4. ADRF5141, 20-Terminal LGA

ESD Model

Withstand Threshold (V)

Class

HBM

±2000 for All Pins

2

CDM

±1250 for All Pins

C3

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.