Test circuit

STAP57060

8/16

Doc ID 15708 Rev 1

6

Test circuit

Figure 15.

Schematic test circuit

Table 7.

Test circuit component part list

V

IN

RF

G

G +

+

OUT

RF

+

D

+

D

V

1.

Dimensions at component symbols are reference for component placement.

2.

Gap between ground & transmission line = 0.056 [1.42] +0.002 [0.05] -0.000 [0.00] typ.

3.

Dimensions of input and output component from edge of transmission lines.

Component

Description

L1, L2

Inductor, 5 turns air wound #22AWG, ID 0.059{1.49}, nylon coated magnet wire

FB1, FB2

Shield bead surface mount EMI

R1

18 k

Ω, 1 W surface mount chip resistor

R2

4.7 M

Ω, 1 W surface mount chip resistor

R3

120

Ω, 2 W surface mount chip resistor

C1, C2

3 pF ATC 100B surface mount ceramic chip capacitor

C3, C10, C11, C15

47 pF ATC 100B surface mount ceramic chip capacitor

C4, C9

0.8-8.0 pF giga trim variable capacitor

C5, C6, C7, C8

7.5 pF ATC 100B surface mount ceramic chip capacitor

C12

1000 pF ATC 700B surface mount ceramic chip capacitor

C13, C17

0.1 µF, 500 V surface mount ceramic chip capacitor

C14

10 µF, 50 V aluminum electrolytic radial lead capacitor

C16

100 pF ATC 100B surface mount ceramic chip capacitor

C18

220 µF, 63 V aluminum electrolytic radial lead capacitor

Board

Roger, Ultra Lam 2000, thk 0.030”,

εr = 2.55 2oz. ED Cu 2 sides.

Obsolete

Product(s)

- Obsolete

Product(s)