List of figures

Figure 1.

STBC15 application schematic ......................................................... 2

Figure 2.

Pin connection (top through view) ....................................................... 3

Figure 3.

ICC vs. temperature (VBAT = 3.6 V; IOUT = 1 mA) ............................................. 8

Figure 4.

Floating voltage vs. temperature ........................................................ 8

Figure 5.

Charge current vs. temperature ........................................................ 8

Figure 6.

RON M3 vs. temperature ............................................................. 8

Figure 7.

Battery leakage current vs. VBAT (VCHGIN = 0 V; VBAT > VBAT_OVD) ................................ 9

Figure 8.

Battery leakage current vs. VBAT (VCHGIN = 0 V; VBAT < VBAT_OVD; shelf mode) ....................... 9

Figure 9.

STBC15 block diagram ............................................................. 10

Figure 10.

Operational simplified state machine diagram .............................................. 11

Figure 11.

QFN12 (1.7 x 2.0 mm) package outline .................................................. 14

Figure 12.

QFN12 (1.7 x 2.0 mm) recommended footprint ............................................. 15

Figure 13.

Flip-chip12 (1.1 x 1.41 mm) package outline............................................... 16

Figure 14.

Flip-chip12 (1.1 x 1.41 mm) recommended footprint ......................................... 17

STBC15

List of figures

DS12551 - Rev 1

page 22/23