3

Maximum ratings

Table 3. Absolute maximum ratings

Symbol

Parameter

Test conditions

Value

Unit

CHGIN

Input supply voltage pin

DC voltage

-0.3 to +7.0

V

BAT

Battery pin and system OUT pin

DC voltage

-0.3 to +5.5

V

Non repetitive,

60 s pulse length

-0.3 to +6.0

V

OUT

Battery pin and system OUT pin

DC voltage

-0.3 to +6.0

V

CHGINOK, VSET0,1, ISET0,1, PG, SM, PKM

I/O pins

DC voltage

-0.3 to +7.0

V

ESD

Charged device model (CDM)

±500

V

Human body model (all the others)

±2000

V

TAMB

Operating ambient temperature

-40 to +85

°C

TJ

Maximum junction temperature

+125

°C

TSTG

Storage temperature

-65 to +150

°C

Note:

Absolute maximum ratings are those values beyond which damage to the device may occur. Functional

operation under these conditions is not implied.

Table 4. Thermal data

Symbol

Parameter

QFN12

Flip-chip12

Unit

RTHJB(1)

Junction-to-pcb board thermal resistance

100

160

°C/W

1. Standard FR4 pcb board.

STBC15

Maximum ratings

DS12551 - Rev 1

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