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STP3N150 数据表(PDF) 2 Page - STMicroelectronics |
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STP3N150 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 22 page ![]() 1 Electrical ratings Table 1. Symbol Parameter Value Unit TO-3PF H2PAK-2 TO-220 TO-247 VDS Drain-source voltage 1500 V VGS Gate-source voltage ±30 V ID Drain current (continuous) at TC = 25 °C 2.5(1) 2.5 A Drain current (continuous) at TC = 100 °C 1.6(1) 1.6 IDM(2) Drain current (pulsed) 10 A PTOT Total power dissipation at TC = 25 °C 63 140 W VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 °C) 3.5 kV Derating factor 0.5 1.12 W/°C Tstg Storage temperature range -55 to 150 °C TJ Operating junction temperature range 1. Limited by maximum junction temperature. 2. Pulse width limited by safe operating area. Table 2. Thermal data Symbol Parameter Value Unit TO-3PF H2PAK-2 TO-220 TO-247 Rthj-case Thermal resistance junction-case 2 0.89 °C/W Rthj-amb Thermal resistance junction-ambient 50 62.5 50 °C/W Rthj-pcb(1) Thermal resistance junction-pcb 35 °C/W 1. When mounted on 1 inch2 FR-4 board, 2 oz Cu. Table 3. Symbol Parameter Max value Unit IAR Avalanche current, repetitive or not-repetitive (pulse width limited by TJ max) 2.5 A EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) 450 mJ STFW3N150, STH3N150-2, STP3N150, STW3N150 Electrical ratings DS5052 - Rev 12 page 2/22 |
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