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Revision 2.1

17 - 19

AS1108

Data Sheet

Package Drawings and Markings

Figure 14. 20-pin SOIC Package

Symbol

Millimeters

Min

Max

A

2.44

2.64

A1

0.10

0.30

A2

2.24

2.44

B

0.36

0.46

C

0.23

0.32

e1.27 BSC

H10.11

10.51

h

0.31

0.71

J

0.53

0.73

K7º BSC

L

0.51

1.01

R

0.63

0.89

ZD

0.66 REF

α

0º

8º

Notes:

1. Lead coplanarity should be 0 to 0.10mm (.004”) max.

2. Package surface finishing:

(2.1) Top: matte (charmilles #18-30).

(2.2) All sides: matte (charmilles #18-30).

(2.3) Bottom: smooth or matte (charmilles #18-30).

3. All dimensions exclusive of mold flash, and end flash from the pack-

age body shall not exceed 0.24mm (0.10”) per side (D).