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Revision 2.1

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AS1108

Data Sheet

4 Absolute Maximum Ratings

Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical

Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 1. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Voltage (with respect to

GND)

-0.3

7

V

DIN, CLK, LOAD/CSN

-0.3

7

V

All Other Pins

-0.3

7 or

0.3

V

Current

DIG 0:DIG 3

Sink Current

500

mA

SEG A:SEG G, SEG DP

100

mA

Continuous Power

Narrow Plastic DIP

1066

mW

Derate 13.3mW/ºC above +70ºC

Wide SOIC

941

mW

Derate 11.8mW/ºC above +70ºC

0

+70

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature (Wide SOIC)

1

1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020C

“Moisture/Reflow Sensitivity Classification for non-hermetic Solid State Surface Mount Devices”.

+260

ºC

Soldering Temperature (Narrow DIP)

2

2. Specified according JESD22-B106 “Resistance to Soldering Temperature for Through-Hole Mounted Devices”.

+260

ºC

Humidity

5

85

%

Non-condensing

Electrostatic Discharge

3

3. Norm: MIL 883 E method 3015.

Digital Outputs

1000

V

All Other Pins

1000

V

Latch-Up Immunity

4

4. Norm: JEDEC 17.

±200

mA

All pins.

Except pin 11: ±180mA.