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T56D107M025CSS025 数据表(PDF) 15 Page - Vishay Siliconix |
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T56D107M025CSS025 数据表(HTML) 15 Page - Vishay Siliconix |
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15 / 19 page ![]() Polymer Guide www.vishay.com Vishay Revision: 08-Sep-2022 9 Document Number: 40076 For technical questions, contact: polytech@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKING AND STORAGE Polymer capacitors meet moisture sensitivity level rating (MSL) of 3 or 4 as specified in IPC/JEDEC® J-STD-020 and are dry packaged in moisture barrier bags (MBB) per J-STD-033. MSL for each particular family is defined in the datasheet - either in “Features” section or “Standard Ratings” table. Level 3 specifies a floor life (out of bag) of 168 hours and level 4 specifies a floor life of 72 hours at 30 °C maximum and 60 % relative humidity (RH). Unused capacitors should be re-sealed in the MBB with fresh desiccant. A moisture strip (humidity indicator card) is included in the bag to assure dryness. To remove excess moisture, capacitors can be dried at 40 °C (standard “dry box” conditions). For detailed recommendations please refer to J-STD-033. Note (1) For T27, lead (Pb)-free capacitors tp = 30 s Notes • T50, T51, T52, T55, T56, and T58 capacitors are process sensitive. PSL classification to JEDEC J-STD-075: R4G • T54 and T59 capacitors with 100 % tin termination are process sensitive. PSL classification to JEDEC J-STD-075: R6G RECOMMENDED REFLOW PROFILES Vishay recommends no more than 3 cycles of reflow in accordance with J-STD-020. PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY PREHEAT AND SOAK Temperature min. (TSmin.) 100 °C 150 °C Temperature max. (TSmax.) 150 °C 200 °C Time (tS) from (TSmin. to TSmax.) 60 s to 120 s 60 s to 120 s RAMP UP Ramp-up rate (TL to Tp) 3 °C/s maximum Liquidus temperature (TL) 183 °C 217 °C Time (tL) maintained above TL 60 s to 150 s Peak package body temperature (Tp) max. Depends on type and case - see table below Time (tp) within 5 °C of the peak max. temperature 20 s 5 s (1) RAMP DOWN Ramp-down rate (Tp to TL) 6 °C/s maximum Time from 25 °C to peak temperature 6 min maximum 8 min maximum PEAK PACKAGE BODY TEMPERATURE (Tp) MAXIMUM TYPE CASE CODE PEAK PACKAGE BODY TEMPERATURE (TP) MAX. SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY T27 D 220 °C 245 °C T55 J, P, A, T, B, C, Z, V, D n/a 260 °C T52 E5, M1, M9, B2 260 °C T58 MM, W9, W0, A0, BB 260 °C T50 D 260 °C T51 D, V 260 °C T56 B, D, V 250 °C T59 EE 220 °C 250 °C T54 3E, 6E, EE, E2, E3, E4, E6 220 °C 250 °C 20021 EE 220 °C n/a Time t S Time 25 °C to peak t p T P T L T Smin. 25 t L T Smax. Preheat area Max. ramp up rate = 3 °C/s Max. ramp down rate = 6 °C/s |
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