Polymer Guide

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Revision: 08-Sep-2022

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Document Number: 40076

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5.2

Limit Pressure on Capacitor Installation with

Mounter: pressure must not exceed 4.9 N with a tool

end diameter of 1.5 mm when applied to the

capacitors using an absorber, centering tweezers, or

similar (maximum permitted pressurization time: 5 s).

An excessively low absorber setting position would

result in not only the application of undue force to the

capacitors but capacitor and other component

scattering, circuit board wiring breakage, and / or

cracking as well, particularly when the capacitors are

mounted together with other chips having a height of

1 mm or less.

5.3

Flux Selection

5.3.1

Select a flux that contains a minimum of chlorine and

amine.

5.3.2

After flux use, the chlorine and amine in the flux

remain must be removed.

5.4

Cleaning After Mounting: the following solvents are

usable when cleaning the capacitors after mounting.

Never use a highly active solvent.

• Halogen organic solvent (HCFC225, etc.)

• Alcoholic solvent (IPA, ethanol, etc.)

• Petroleum solvent, alkali saponifying agent, water,

etc.

Circuit board cleaning must be conducted at a

temperature of not higher than 50 °C and for an

immersion time of not longer than 30 minutes. When

an ultrasonic cleaning method is used, cleaning must

be conducted at a frequency of 48 kHz or lower, at

an vibrator output of 0.02 W/cm3, at a temperature of

not higher than 40 °C, and for a time of 5 minutes or

shorter.

Notes

• Care must be exercised in cleaning process so that the

mounted capacitor will not come into contact with any

cleaned object or the like or will not get rubbed by a stiff

brush or similar. If such precautions are not taken

particularly when the ultrasonic cleaning method is

employed, terminal breakage may occur

• When performing ultrasonic cleaning under conditions

other than stated above, conduct adequate advance

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