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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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101SHS100CS6LE 数据表(PDF) 30 Page - Exxelia Group |
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101SHS100CS6LE 数据表(HTML) 30 Page - Exxelia Group |
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30 / 34 page  CERAMIC CAPACITORS 12 www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensions SOLDERING ADVICES FOR REFLOW SOLDERING Dimensions in inches (in mm) Reflow soldering Wave soldering I1 I2 I3 I1 I2 I3 0402 0.043 (1.1) 0.035 (0.9) 0.012 (0.3) 0.043 (1.1) 0.047 (1.2) 0.012 (0.3) 0403 0.055 (1.4) 0.035 (0.9) 0.012 (0.3) 0.055 (1.4) 0.047 (1.2) 0.012 (0.3) 0504 0.063 (1.6) 0.051 (1.3) 0.016 (0.4) 0.063 (1.6) 0.063 (1.6) 0.016 (0.4) 0603 0.055 (1.4) 0.059 (1.5) 0.02 (0.5) 0.055 (1.4) 0.071 (1.8) 0.02 (0.5) 0805 0.073 (1.85) 0.065 (1.65) 0.024 (0.6) 0.073 (1.85) 0.077 (1.95) 0.024 (0.6) 0907 0.094 (2.4) 0.065 (1.65) 0.035 (0.9) 0.094 (2.4) 0.077 (1.95) 0.035 (0.9) 1005 0.073 (1.85) 0.067 (1.7) 0.039 (1) 0.073 (1.85) 0.079 (2) 0.039 (1) 1206 0.083 (2.1) 0.067 (1.7) 0.059 (1.5) 0.083 (2.1) 0.079 (2) 0.059 (1.5) 1210 0.118 (3) 0.069 (1.75) 0.059 (1.5) 0.118 (3) 0.081 (2.05) 0.059 (1.5) 1605 0.073 (1.85) 0.071 (1.8) 0.087 (2.2) 0.073 (1.85) 0.083 (2.1) 0.087 (2.2) 1806 0.087 (2.2) 0.073 (1.85) 0.102 (2.6) 0.087 (2.2) 0.085 (2.15) 0.102 (2.6) 1812 0.152 (3.85) 0.073 (1.85) 0.102 (2.6) 0.152 (3.85) 0.085 (2.15) 0.102 (2.6) 1825 0.281 (7.15) 0.073 (1.85) 0.102 (2.6) 0.281 (7.15) 0.085 (2.15) 0.102 (2.6) 2210 0.13 (3.3) 0.079 (2) 0.146 (3.7) 0.13 (3.3) 0.091 (2.3) 0.146 (3.7) 2220 0.228 (5.8) 0.079 (2) 0.146 (3.7) 0.228 (5.8) 0.091 (2.3) 0.146 (3.7) 2225 0.281 (7.15) 0.079 (2) 0.146 (3.7) 0.281 (7.15) 0.091 (2.3) 0.146 (3.7) l2 l3 User Guide Large chips above size 2225 are not recommended to be mounted on epoxy board due to thermal ex- pansion coefficient mismatch between ceramic ca- pacitor and epoxy. Where larger sizes are required, it is recommended to use components with ribbon or other adapted leads so as to absorb thermo-me- chanical strains. RECOMMENDED FOOTPRINT FOR SMD CAPACITORS Ceramic is by nature a material which is sensitive both thermally and mechan- ically. Stresses caused by the physical and thermal properties of the capaci- tors, substrates and solders are attenuated by the leads. Wave soldering is unsuitable for sizes larger than 2220 and for the higher ends of capacitance ranges due to possible thermal shock (capacitance values giv- en upon request). Infrared and vapor phase reflow, are preferred for high reliability applications as inherent thermo-mechanical strains are lower than those inherent to wave soldering. Whatever the soldering process is, it is highly recommended to apply a thermal cycle, see hereafter our recommended soldering profile: Preheat zone 0 50 100 150 200 250 0 12 3 4 5 Time (min) 215°C 250°C 20°C >50°C/s Natural cool down RoHS No RoHS 0 50 100 150 200 250 0 12 3 4 5 Time (min) 20°C 215°C-225°C 245°C-255°C Natural cool down RoHS No RoHS 0 50 100 150 200 250 0 12 3 4 Time (min) 20°C 300 250°C 280°C Natural cool down RoHS No RoHS RECOMMENDED VAPOR PHASE REFLOW PROFILE RECOMMENDED IR REFLOW PROFIL RECOMMENDED WAVE SOLDERING PROFILE SOLDERING ADVICES FOR IRON SOLDERING Attachment with a soldering iron is discouraged due to ceramic brittleness and the process control limitations. In the event that a soldering iron must be used, the following precautions should be observed: • Use a substrate with chip footprints big enough to allow putting side by side one end of the capacitor and the iron tip without any contact between this tip and the component, • place the capacitor on this footprint, • heat the substrate until the capacitor’s temperature reaches 150°C minimum (preheating step, maximum 1°C per second), • place the hot iron tip (a flat tip is preferred) on the footprint without touching the capacitor. Use a regulated iron with a 30 watts maximum power. The recommended temperature of the iron is 270 ±10°C. The tem- perature gap between the capacitor and the iron tip must not exceed 120°C, |
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