101SHS100CS6LE datasheet(4/34 Pages) EXXELIA

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CERAMIC CAPACITORS

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Page revised 06/20

CAPACITOR TERMINATIONS AND SOLDERING

RECOMMENDATIONS

I. TERMINATION TYPES

Our capacitors are delivered with one of the following terminations (for

technical reasons, only a limited number of termination types are available in

certain cases). All our terminations are backward compatible.

NB:

• terminations type C recommended for non magnetic applications.

• termination type A available for non magnetic applications (for historical

reason, we have also another code, the code “P”, for the same type of

termination. The parts that were designed-in before 2005 might still have

a code “P” instead of “A” in the part numbering. But both codes correspond

to the same type of termination).

II. SPECIFICATIONS

Care must be taken when using particular terminations: if the terminations are

heated up above a particular temperature and/or for too long a period of time,

there is a risk of leaching (dissolution of the termination revealing the inner

electrodes).

The chart below gives the resistance to soldering heat per termination type,

based on a SAC387 solder bath at 260°C.

Dielectric Type

CHA / SHA

10 ±1s (3)

120 ±5s

CHB / SHB

30 ±2s

120 ±5s

CPX / CLX / CPE / CLE

30 ±2s

120 ±5s

CLF

10 ±2s (1)

On request

120 ±5s

SHL

120 ±5s

SHS

10 ±1s (4)

120 ±5s

SHF / SHN / SHT

5 ±1s (2)

120 ±5s

(1): results extrapolated from 30±2s data obtained with Sn62/Pb36/Ag2 solder bath.

(2): data obtained with Sn62/Pb36/Ag2 solder bath.

(3): termination only available on CHA series.

(4): preliminary data.

III. STANDARD SMD REQUIREMENTS

III.1. Soldering Recommendations

Regarding the soldering attachments, three methods are generally used: the

vapor phase soldering, the infrared reﬂow soldering and the wave soldering.

Unless particular skill about the use of the wave soldering, this method is not

recommended since the melted solder is directly in contact with the ceramic.

This can potentially crack the capacitor because the ceramic is sensible to the

thermal shocks. Moreover, this method needs to maintain the components

with an insulating resin which increases the thermo-mechanical strains

between the ceramic and the board both on soldering phase and operating

condition. The vapor phase and IR reﬂow soldering are less aggressive,

inducing more restricted thermal shocks. This is the reason why they are

preferred to the wave soldering method for reliable applications. In all cases,

proper pre-heating is essential.

The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of

the maximum soldering temperature. While multilayer ceramic capacitors can

withstand the peak soldering temperatures for short durations, they should be

minimized whenever possible.

Above precaution given for SMD types are applicable for the implementation

of large bare chips (1515 and above). But in general, large bare chips above

2225 are not recommended to be mounted on epoxy printed board due to the

thermal expansion mismatch between ceramic capacitor body and epoxy. This

is the reason why leaded components will be preferred especially for reliable

applications.

For information, the typical thermal proﬁles of these three soldering processes

are given hereafter. These typical diagrams are only given as an aid to SMD

users in determining speciﬁc processes linked to their instrumentations and

to their own experience.

NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards.

Please, refer to this standard for more information.

III.1.1. Vapour Phase Soldering

0°C

20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s

250°C

230°C

20s ... 40s

ca. 60s ... 130s

>217°C

217°C

Ramp down

rate <6K/s

Ramp up

rate <3K/s

200°C

150°C

100°C

50°C

Lead free SnAgCu solders - Vapour Phase

0°C

20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s

250°C

210°C

20s ... 40s

ca. 60s ... 150s

<180°C

180°C

Ramp down

rate <6K/s

Ramp up

rate <3K/s

200°C

150°C

100°C

50°C

SnPb solders – Infrared Soldering

NB: the lines indicate the upper and lower limits of typical process (terminal

temperature).

Parameter

Value

Comment

Termination

Materials

non-magnetic (silver-palladium)

non-magnetic (pure tin over copper barrier)

lead-free (pure tin over nickel barrier)

General Information

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