Electrical and thermal ratings

VIPer11

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DS11873 Rev 5

2

Electrical and thermal ratings

Table 2. Absolute maximum ratings

Symbol

Pin

Parameter(1), (2)

1. Stresses beyond those listed absolute maximum ratings may cause permanent damage to the device.

2. Exposure to absolute-maximum-rated conditions for extended periods may affect the device reliability.

Min.

Max.

Unit

VDS

6 to 10 Drain-to-source (ground) voltage

-

800

V

IDRAIN

6 to 10 Pulsed drain current (pulse-width limited by SOA)

-

2

A

VCC

2

VCC voltage

-0.3

Internally

limited

V

ICC

2

VCC internal Zener current (pulsed)

-

45(3)

3. Pulse-width limited by maximum power dissipation, PTOT.

mA

VDIS

3

DIS voltage

-0.3

5(4)

4. The AMR value is intended when VCC 5 V, otherwise the value VCC + 0.3 V has to be considered.

V

VFB

4

FB voltage

-0.3

5(4)

V

VCOMP

5

COMP voltage

-0.3

5((4)

V

PTOT

-

Power dissipation at Tamb < 50 °C

-

1(5)

5. When mounted on a standard single side FR4 board with 100 mm² (0.1552 inch) of Cu (35 μm thick).

W

TJ

-

Junction temperature operating range

-40

150

°C

TSTG

-

Storage temperature

-55

150

°C

Table 3. Thermal data

Symbol

Parameter

Max. value

Unit

RTH-JC

Thermal resistance junction to case(1)

(Dissipated power = 1 W)

1. When mounted on a standard single side FR4 board with minimum copper area.

10

°C/W

RTH-JA

Thermal resistance junction ambient(1)

(Dissipated power = 1 W)

155

°C/W

RTH-JC

Thermal resistance junction to case(2)

(Dissipated power = 1 W)

5

°C/W

RTH-JA

Thermal resistance junction ambient(2)

(Dissipated power = 1 W)

2. When mounted on a standard single side FR4 board with 100 mm2 (0.155 sq in) of Cu (35 μm thick).

95

°C/W