Data Sheet

ADRF5050

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 14

For recommended operating conditions, see Table 1 and Table 2.

Table 3. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage

VDD

−0.3 V to +3.6 V

VSS

−3.6 V to +0.3 V

Digital Control Inputs1

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power2

Dual Supply (VDD = 3.3 V, VSS = −3.3 V,

frequency = 100 MHz to 20 GHz, TCASE =

85°C3)

Through Path

33.5 dBm

Terminated Path

18.5 dBm

Hot Switching (RFC)

30.5 dBm

Single Supply (VDD = 3.3 V, VSS = 0 V,

frequency = 100 MHz to 20 GHz, TCASE =

85°C3)

Through Path

22.5 dBm

Terminated Path

12.5 dBm

Hot Switching (RFC)

19.5 dBm

Unbiased (VDD = 0 V, VSS = 0 V)

18 dBm

Temperature

Junction, TJ

135°C

Storage Range

−65°C to +150°C

Reflow

260°C

1 Overvoltages at the digital control inputs are clamped by internal diodes.

Current must be limited to the maximum rating given.

2 For power derating over frequency, see Figure 2

3 For 105°C operation, the power handling degrades from the TCASE = 85°C

specification by 3 dB.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required. θJC is the junction to case bottom

(channel to package bottom) thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC1

Unit

CC-24-16

Through Path

110

°C/W

Table 4. Thermal Resistance (Continued)

Package Type

θJC1

Unit

Terminated Path

200

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

round pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD

sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADRF5050

Table 5. ADRF5050, 24-Terminal LGA

ESD Model

Withstand Threshold

(V)

Class

HBM

RFx and RFC Pins

1000

1C

Supply and Control Pins

2000

2

CDM

500

C2A

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.